CANUNDA-SPLIT enables high efficiency femtosecond laser processing using beam splitting technology

LASEA, Belgium (CANUNDA-SPLIT)

Lasea
The partner

LASEA is a Belgian company that designs and supplies software, machines and modules, and performs feasibility tests for precision laser machining. A major challenge of this industry is to improve the efficiency of laser processes, such as thin film ablation. One of the most promising solutions is beam splitting, which requires a robust, femtosecond laser-compatible beam shaping technology.

The application

Thin film ablation is the selective ablation of one or more layers from a multi-material substrate. This process is mainly used for manufacturing photovoltaic panels, OLED panels and electronics.

The issue

A major challenge of this application is to improve the efficiency of laser processes. One of the most promising solutions is parallel processing, which requires a robust, femtosecond laser-compatible beam shaping technology

The CANUNDA-SPLIT solution

CANUNDA-SPLIT is a beam splitting module which enables parallel ablation of thin films.
With its fully reflective design, this module can handle high energy femtosecond laser pulses with stability. CANUNDA-SPLIT makes it possible to select different beam splitting patterns (number of spots, etc.). This solution can also be easily integrated in an industrial environment

“Beam splitting enables higher productivity while maintaining the quality and flexibility of ultrashort pulse laser-based processing.

Anne Henrottin, Optical devices & metrology unit manager LASEA

Industrial integration of CANUNDA-SPLIT

At LASEA’s premises, a CANUNDA-SPLIT module was installed on a micromachining platform in order to optimize thin film ablation of molybdenum on steel substrate.

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Intensity profile of the sub-beams generated by CANUNDA-SPLIT